Gaurang Choksi

Gaurang Choksi is a retired semiconductor industry executive with many years of leadership experience in research & technology development in microelectronic packaging and assembly. He retired as a Vice President in the Technology Development organization at Intel Corporation. 

He joined Intel in 1988, after receiving his Ph.D. degree in Engineering Mechanics from Virginia Tech. During his 36+ years at Intel, he contributed to various areas related to electronic packaging & assembly process development, and 2.5D/3D heterogeneous integration. This included structural analysis and testing, electrical and physical design and analysis, CAD and analysis tool development, power delivery, high speed signaling, thermal technologies and solutions, and fundamental understanding and quantification for optimization of assembly process, equipment, materials, and design parameters. 

The scope of the organization he managed and focused on during his tenure at Intel included a diverse set of experimental and modeling & simulation capabilities, supporting materials selection & characterization, and providing / assessing technology solutions for electronic packaging and assembly process development. This involved dimensional measurements, and modeling and lab-based validation related to structural integrity and reliability across market segments and end-use conditions, integrated voltage regulation and power delivery, high-speed interfaces and co-packaged optics, and thermals / heat dissipation. 

Products and technologies supported over the years covered all Intel market segments and platforms such as CPU’s, chipsets, memory systems, and communication and network processors. He has served on academic and national advisory boards.

Focus Area

Electronic packaging, assembly & test process development, modeling/simulation and experimental tools/methods.